Lee, Fundamentals of Lead-Free Solder Interconnect Technology.
Lee, Fundamentals of Lead-Free Solder Interconnect Technology.
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Lee, Tae-Kyu; et al.: Fundamentals of Lead-Free Solder Interconnect Technology. From Microstructures to Reliability. New York, Springer, 2015. XIII, 253 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped.
Unser Preis: EUR 14,-- |